RF engineers seem to have differing preferences in the details, but some common themes emerge.
Traces are impedance controlled. GND vias are placed as close as practical to their respective devices, as stray inductance is strongly correlated to trace length.
Vias are kept large, both to reduce inductance, and to improve heat flow. Many active RF components require significant cooling.
Parts within a signal chain are ganged together in tightly grouped straightish lines. Wide spacing between different circuit groups is a design criterion, but achieving this in practice is sometimes very difficult. RF circuits tend to find themselves crammed into tiny mobile enclosures.
Copyright (c) 1995-2012 gendreaumicrosystems.com. All rights reserved. Design by CSS Templates.